Customers Now Designing in Avago PAM4 Transceivers Across Copper Backplane, Direct-Attached Cables and Optics, Doubling System IO. Avago Technologies (NASDAQ:AVGO) says it has demonstrated what it asserts is the first Gbps pulse-amplitude modulation (PAM)4. Avago Technologies introduces a gearbox PHY IC for transmitting high speed data.

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HMC has been recognized by industry leaders and influencers as the long-awaited answer to the growing gap between the performance improvement rate of DRAM and processor data consumption svago. About Avago Technologies Avago Technologies is a leading designer, developer and global supplier of a broad range of analog, mixed signal and optoelectronics components and subsystems with a focus in III-V compound semiconductor design and processing.

56 Gbps PAM4 SerDes targets next generation switches and routers

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56 Gbps PAM4 SerDes targets next generation switches and routers | eeNews Europe

The Avago 56Gbps PAM4 SerDes is serde to support a wide range of copper and optical interconnects ranging from chip-to-chip, chip-to-module, low-cost direct-attached cable, and copper backplane down to 35 dB loss.

AVGOa leading supplier of analog interface components for wireless, wireline, and industrial applications, today announced that Micron Technology, Inc. About Micron Micron Technology, Inc.

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This site uses cookies to enhance your visitor experience. Add Comment Text Only character limit. The SerDes cores feature unique decision feedback equalization DFEresulting in lower overall power usage.

These cookies allow you to share your favourite content of the Site with other people via social networks. Additional key differentiators include best-in-class data latency, noise immunity, jitter, and crosstalk performance. To learn more about Micron Technology, Inc. Backed by an extensive portfolio of intellectual property, Avago products serve three primary target markets: Avago Technologies has demonstrated the first 56 Gbps pulse-amplitude modulation PAM vaago SerDes across copper backplanes and optical interconnects targeting next-generation srrdes and routers.


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Rack-level applications will particularly benefit from PAM4 technology realizing advantages in space, power, cost, and simplified cabling. Information, technical specifications, tools and support for adopting HMC can be found at www.

Please login to comment on the article. As an industry-recognized technological breakthrough, Micron HMC devices use advanced through-silicon vias TSVs —vertical conduits that electrically connect a stack of individual chips—to combine high-performance logic with Micron’s state-of-the-art DRAM.